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TC4423A/TC4424A/TC4425A
3A Dual High-Speed Power MOSFET Drivers
Features
* High Peak Output Current: 4.5A (typical) * Wide Input Supply Voltage Operating Range: - 4.5V to 18V * High Capacitive Load Drive Capability: - 1800 pF in 12 ns * Short Delay Times: 40 ns (typical) * Matched Rise/Fall Times * Low Supply Current: - With Logic `1' Input - 1.0 mA (maximum) - With Logic `0' Input - 150 A (maximum) * Low Output Impedance: 2.5 (typical) * Latch-Up Protected: Will Withstand 1.5A Reverse Current * Logic Input Will Withstand Negative Swing Up To 5V * Pin compatible with the TC4423/TC4424/TC4425 and TC4426A/TC4427A/TC4428A devices * Space-saving 8-Pin 150 mil body SOIC and 8-Pin 6x5 DFN Packages
General Description
The TC4423A/TC4424A/TC4425A devices are a family of dual-output 3A buffers/MOSFET drivers. These devices are improved versions of the earlier TC4423/ TC4424/TC4425 dual-output 3A driver family. This improved version features higher peak output current drive capability, lower shoot-throught current, matched rise/fall times and propagation delay times. The TC4423A/TC4424A/TC4425A devices are pincompatible with the existing TC4423/TC4424/TC4425 family. An 8-pin SOIC package option has been added to the family. The 8-pin DFN package option offers increased power dissipation capability for driving heavier capacitive or resistive loads. The TC4423A/TC4424A/TC4425A MOSFET drivers can easily charge and discharge 1800 pF gate capacitance in under 20 ns, provide low enough impedances in both the on and off states to ensure the MOSFET's intended state will not be affected, even by large transients. The TC4423A/TC4424A/TC4425A inputs may be driven directly from either TTL or CMOS (2.4V to 18V). In addition, the 300 mV of built-in hysteresis provides noise immunity and allows the device to be driven from slow rising or falling waveforms. The TC4423A/TC4424A/TC4425A dual-output 3A MOSFET driver family is offerd with a -40oC to +125oC temperature rating, making it useful in any wide temperature range application.
Applications
* * * * Switch Mode Power Supplies Pulse Transformer Drive Line Drivers Direct Drive of Small DC Motors
Package Types
8-Pin PDIP/SOIC TC4423A TC4424A TC4425A
NC IN A GND IN B
1 8 2 TC4423A 7 3 TC4424A 6 4 TC4425A 5
16-Pin SOIC (Wide )
NC IN A NC GND GND NC IN B NC
1 2 3 4 5 6 7 8 16 15 14 13 12 11 10 9
TC4423A TC4424A TC4425A
NC OUT A OUT A VDD VDD OUT B OUT B NC NC OUT A OUT A VDD VDD OUT B OUT B NC NC OUT A OUT A VDD VDD OUT B OUT B NC
NC OUT A VDD OUT B
NC OUT A VDD OUT B
NC OUT A VDD OUT B
TC4423A TC4424A TC4425A
8-Pin 6x5
NC 1 IN A 2 GND
3
DFN (1)
8
TC4423A TC4424A TC4425A
NC OUT A VDD OUT B NC OUT A VDD OUT B NC OUT A VDD OUT B
TC4423A TC4424A TC4425A
7 6 5
IN B 4
Note 1: Exposed pad of the DFN package is electrically isolated. 2: Duplicate pins must both be connected for proper operation.
(c) 2007 Microchip Technology Inc.
DS21998B-page 1
TC4423A/TC4424A/TC4425A
Functional Block Diagram(1)
Inverting 750 A 300 mV Output VDD
Input Effective Input C = 20 pF (Each Input) GND 4.7V
Non-inverting TC4423A Dual Inverting TC4424A Dual Non-inverting TC4425A Inverting / Non-inverting
Note 1: Unused inputs should be grounded.
DS21998B-page 2
(c) 2007 Microchip Technology Inc.
TC4423A/TC4424A/TC4425A
1.0 ELECTRICAL CHARACTERISTICS
Notice: Stresses above those listed under "Maximum Ratings" may cause permanent damage to the device. This is a stress rating only and functional operation of the device at those or any other conditions above those indicated in the operational sections of this specification is not intended. Exposure to maximum rating conditions for extended periods may affect device reliability.
Absolute Maximum Ratings
Supply Voltage ................................................................+20V Input Voltage, IN A or IN B .......... (VDD + 0.3V) to (GND - 5V) Package Power Dissipation (TA=50C) 8L PDIP .......................................................................1.2W 8L SOIC.................................................................... 0.61W 16L SOIC.....................................................................1.1W 8L DFN .................................................................... Note 3
DC CHARACTERISTICS (NOTE 2)
Electrical Specifications: Unless otherwise indicated, TA = +25C, with 4.5V VDD 18V. Parameters Input Logic `1', High Input Voltage Logic `0', Low Input Voltage Input Current Input Voltage Output High Output Voltage Low Output Voltage Output Resistance, High Output Resistance, Low Peak Output Current Latch-Up Protection Withstand Reverse Current Switching Time (Note 1) Rise Time Fall Time Delay Time Delay Time Power Supply Supply Voltage Power Supply Current Note 1: 2: 3: VDD IS IS 4.5 -- -- -- 1.0 0.15 18 2.0 0.25 V mA mA VIN = 3V (Both inputs) VIN = 0V (Both inputs) tR tF tD1 tD2 -- -- -- -- 12 12 40 41 21 21 48 48 ns ns ns ns Figure 4-1, Figure 4-2, CL = 1800 pF Figure 4-1, Figure 4-2, CL = 1800 pF Figure 4-1, Figure 4-2, CL = 1800 pF Figure 4-1, Figure 4-2, CL = 1800 pF VOH VOL ROH ROL IPK IREV VDD - 0.025 -- -- -- -- -- -- -- 2.2 2.8 4.5 >1.5 -- 0.025 3.0 3.5 -- -- V V A A DC Test DC Test IOUT = 10 mA, VDD = 18V IOUT = 10 mA, VDD = 18V 10V VDD 18V (Note 2) Duty cycle 2%, t 300 sec. VIH VIL IIN VIN 2.4 -- -1 -5 1.5 1.3 -- -- -- 0.8 1 VDD+0.3 V V A V 0V VIN VDD Sym Min Typ Max Units Conditions
Switching times ensured by design. Tested during characterization, not production tested. Package power dissipation is dependent on the copper pad area on the PCB.
(c) 2007 Microchip Technology Inc.
DS21998B-page 3
TC4423A/TC4424A/TC4425A
DC CHARACTERISTICS (OVER OPERATING TEMPERATURE RANGE)
Electrical Specifications: Unless otherwise indicated, operating temperature range with 4.5V VDD 18V. Parameters Input Logic `1', High Input Voltage Logic `0', Low Input Voltage Input Current Output High Output Voltage Low Output Voltage Output Resistance, High Output Resistance, Low Switching Time (Note 1) Rise Time Fall Time Delay Time Delay Time Power Supply Power Supply Current IS -- -- 2.0 0.2 3.0 0.3 mA VIN = 3V (Both inputs) VIN = 0V (Both inputs) tR tF tD1 tD2 -- -- -- -- 20 22 50 50 31 31 66 66 ns ns ns ns Figure 4-1, Figure 4-2, CL = 1800 pF Figure 4-1, Figure 4-2, CL = 1800 pF Figure 4-1, Figure 4-2, CL = 1800 pF Figure 4-1, Figure 4-2, CL = 1800 pF VOH VOL ROH ROL VDD - 0.025 -- -- -- -- -- 3.1 3.7 -- 0.025 6 7 V V IOUT = 10 mA, VDD = 18V IOUT = 10 mA, VDD = 18V VIH VIL IIN 2.4 -- -10 -- -- -- -- 0.8 +10 V V A 0V VIN VDD Sym Min Typ Max Units Conditions
Note 1: Switching times ensured by design.
TEMPERATURE CHARACTERISTICS
Electrical Specifications: Unless otherwise noted, all parameters apply with 4.5V VDD 18V. Parameters Temperature Ranges Specified Temperature Range (V) Maximum Junction Temperature Storage Temperature Range Package Thermal Resistances Thermal Resistance, 8L-6x5 DFN Thermal Resistance, 8L-PDIP Thermal Resistance, 8L-SOIC Thermal Resistance, 16L-SOIC JA JA JA JA -- -- -- -- 33.2 84.6 163 90 -- -- -- -- C/W C/W C/W C/W Typical four-layer board with vias to ground plane TA TJ TA -40 -- -65 -- -- -- +125 +150 +150 C C C Sym Min Typ Max Units Conditions
DS21998B-page 4
(c) 2007 Microchip Technology Inc.
TC4423A/TC4424A/TC4425A
2.0
Note:
TYPICAL PERFORMANCE CURVES
The graphs and tables provided following this note are a statistical summary based on a limited number of samples and are provided for informational purposes only. The performance characteristics listed herein are not tested or guaranteed. In some graphs or tables, the data presented may be outside the specified operating range (e.g., outside specified power supply range) and therefore outside the warranted range.
Note: Unless otherwise indicated, TA = +25C with 4.5V <= VDD <= 18V.
80 70 Rise Time (ns) 50 40 30 20 10 0 4 6 8 10 12 14 16 18 Supply Voltage (V)
470 pF 3,300 pF 1,800 pF 1,000 pF
80 70
4,700 pF
4700 pF 3300 pF
Fall Time (ns)
60
60 50 40 30 20 10 0 4 6
1000 pF
1800 pF
470 pF
8
10
12
14
16
18
Supply Voltage (V)
FIGURE 2-1: Voltage.
60 50 Rise Time (ns) 40 30 20 10 0 100
Rise Time vs. Supply
FIGURE 2-4: Voltage.
70 60
Fall Time vs. Supply
5V
10V
Fall Time (ns)
5V
50 40 30 20 10
15V 10V
15V
1000 Capacitive Load (pF)
10000
0 100
1000 Capacitive Load (pF)
10000
FIGURE 2-2: Load.
24 22 20 Time (ns) 18 16 14 12 10 -40 -25 -10 5
tRISE
Rise Time vs. Capacitive
FIGURE 2-5: Load.
145 Propagation Delay (ns)
Fall Time vs. Capacitive
CLOAD = 1800 pF
VDD = 12V
125 105 85 65 45 25
tD2 tD1
CLOAD = 1800 pF
tFALL
20 35 50 65 80 95 110 125 Temperature ( C)
o
2
3
4
5
6
7
8
9
10
Input Amplitude (V)
FIGURE 2-3: Temperature.
Rise and Fall Times vs.
FIGURE 2-6: Amplitude.
Propagation Delay vs. Input
(c) 2007 Microchip Technology Inc.
DS21998B-page 5
TC4423A/TC4424A/TC4425A
Typical Performance Curves (Continued)
Note: Unless otherwise indicated, TA = +25C with 4.5V <= VDD <= 18V.
100 Propagation Delay (ns)
tD1 tD2
Propagation Delay (ns)
90 80 70 60 50 40 30 4 6
CLOAD = 1800 pF
70 65 60 55 50 45 40 35 30
CLOAD = 1800 pF VDD = 18V VIN = 5V
tD2
tD1
8
10
12
14
16
18
-40 -25 -10
5
20
35
50
65
o
80
95 110 125
Supply Voltage (V)
Temperature ( C)
FIGURE 2-7: Supply Voltage.
0.5 Quiescent Current (mA) 0.4 0.3 0.2 0.1 0 4 6 8
Both Inputs = 1
Propagation Delay Time vs.
FIGURE 2-10: Temperature.
0.5 Quiescent Current (mA) 0.4 0.3 0.2
Propagation Delay Time vs.
VDD = 18V
VDD = 18V
Both Inputs = 1
Both Inputs = 0
Both Inputs = 0
0.1 0
10
12
14
16
18
-40 -25 -10
5
20
35
50
65
o
80
95 110 125
Supply Voltage (V)
Temperature ( C)
FIGURE 2-8: Supply Voltage.
7 6
Quiescent Current vs.
FIGURE 2-11: Temperature.
8
Quiescent Current vs.
TJ = 150 C
o
VIN = 5V (TC4424A) VIN = 0V (TC4423A)
7 ROUT-HI ( : ) 6 5 4 3 2
TJ = 150oC
VIN = 0V (TC4424A) VIN = 5V (TC4423A)
) ROUT-LO ( :
5 4 3 2 1 4 6 8 10 12 14 16 18 Supply Voltage (V)
TJ = 25oC
TJ = 25oC
4
6
8
10
12
14
16
18
Supply Voltage (V)
FIGURE 2-9: Output Resistance (Output Low) vs. Supply Voltage.
FIGURE 2-12: Output Resistance (Output High) vs. Supply Voltage.
DS21998B-page 6
(c) 2007 Microchip Technology Inc.
TC4423A/TC4424A/TC4425A
Typical Performance Curves (Continued)
Note: Unless otherwise indicated, TA = +25C with 4.5V <= VDD <= 18V.
120 Supply Current (mA) 100 80 60 40 20 0 100
400 kHz 200 kHz
VDD = 18V
650 kHz 50 kHz 100 kHz
100 90 80 70 60 50 40 30 20 10 0
VDD = 18V
10,000 pF 4,700 pF
Supply Current (mA)
470 pF 1,800 pF 1,000 pF
100 pF
1000 Capacitive Load (pF)
10000
10
100 Frequency (kHz)
1000
FIGURE 2-13: Capacitive Load.
140 Supply Current (mA) 120 100 80 60 40 20
1 MHz 500 kHz
Supply Current vs.
FIGURE 2-16: Frequency.
140 Supply Current (mA) 120 100 80 60 40 20 0 10
Supply Current vs.
VDD = 12V 100 kHz
2 MHz 200 kHz
VDD = 12V 10,000 pF
4,700 pF
1,800 pF 1,000 pF 470 pF 100 pF
0 100
1000 Capacitive Load (pF)
10000
100
1000
10000
Frequency (kHz)
FIGURE 2-14: Capacitive Load.
120 Supply Current (mA) 100 80 60 40 20 0 100
500 kHz
Supply Current vs.
FIGURE 2-17: Frequency.
140 Supply Current (mA)
Supply Current vs.
VDD = 6V
3.5 MHz 2 MHz 100 kHz 200 kHz 1 MHz
VDD = 6V
120 100 80 60 40 20 0 10 100 1000
10,000 pF
4,700 pF
1,800 pF 1,000 pF
100 pF
470 pF
1000 Capacitive Load (pF)
10000
10000
100000
Frequency (kHz)
FIGURE 2-15: Capacitive Load.
Supply Current vs.
FIGURE 2-18: Frequency.
Supply Current vs.
(c) 2007 Microchip Technology Inc.
DS21998B-page 7
TC4423A/TC4424A/TC4425A
Typical Performance Curves (Continued)
Note: Unless otherwise indicated, TA = +25C with 4.5V <= VDD <= 18V.
1.00E-06 -6
10
Crossover Energy (A*sec)
1.00E-07
10-7
1.00E-08
10-8
1.00E-09
10
-9
4
6
8
10
12
14
16
18
Supply Voltage (V)
Note:
The values on this graph represents the loss seen by both drivers in a package during one complete cycle. For a single driver, divide the stated values by 2. For a single transition of a single driver, divide the stated value by 4. Crossover Energy vs.
FIGURE 2-19: Supply Voltage.
DS21998B-page 8
(c) 2007 Microchip Technology Inc.
TC4423A/TC4424A/TC4425A
3.0 PIN DESCRIPTIONS
PIN FUNCTION TABLE (1)
8-Pin DFN 1 2 -- 3 -- -- 4 -- -- 5 -- 6 -- 7 -- 8 PAD 16-Pin SOIC (Wide) 1 2 3 4 5 6 7 8 9 10 11 12 13 14 15 16 -- Symbol NC IN A NC GND GND NC IN B NC NC OUT B OUT B VDD VDD OUT A OUT A NC NC No connection Input A No connection Ground Ground No connection Input B No connection No connection Output B Output B Supply input Supply input Output A Output A No connection Exposed Metal Pad Description The descriptions of the pins are listed in Table 3-1.
TABLE 3-1:
8-Pin PDIP 1 2 -- 3 -- -- 4 -- -- 5 -- 6 -- 7 -- 8 -- Note 1:
Duplicate pins must be connected for proper operation.
3.1
Inputs A and B
3.4
Ground (GND)
Inputs A and B are TTL/CMOS compatible inputs that control outputs A and B, respectively. These inputs have 300 mV of hysteresis between the high and low input levels, allowing them to be driven from slow rising and falling signals, and to provide noise immunity.
Ground is the device return pin. The ground pin should have a low-impedance connection to the bias supply source return. High peak currents will flow out the ground pin when the capacitive load is being discharged.
3.2
Outputs A and B
3.5
Exposed Metal Pad
Outputs A and B are CMOS push-pull outputs that are capable of sourcing and sinking 3A peaks of current (VDD = 18V). The low output impedance ensures the gate of the external MOSFET will stay in the intended state even during large transients. These outputs also have a reverse current latch-up rating of 1.5A.
The exposed metal pad of the DFN package is not internally connected to any potential. Therefore, this pad can be connected to a ground plane or other copper plane on a printed circuit board to aid in heat removal from the package.
3.3
Supply Input (VDD)
VDD is the bias supply input for the MOSFET driver and has a voltage range of 4.5V to 18V. This input must be decoupled to ground with a local ceramic capacitor. This bypass capacitor provides a localized lowimpedance path for the peak currents that are to be provided to the load.
(c) 2007 Microchip Technology Inc.
DS21998B-page 9
TC4423A/TC4424A/TC4425A
4.0 APPLICATIONS INFORMATION
VDD = 18V 1 F WIMA MKS-2 Input 1 2
TC4423A (1/2 TC4425A)
VDD = 18V 0.1 F Ceramic Output CL = 1800 pF Input 1 2
TC4424A (1/2 TC4425A)
1 F WIMA MKS-2
0.1 F Ceramic Output CL = 1800 pF
Input: 100 kHz, square wave, tRISE = tFALL 10 ns +5V Input 0V 18V Output 0V 10% tD1 90% 10% 10% tD2 90% +5V Input 0V 90% 18V Output 0V 10%
Input: 100 kHz, square wave, tRISE = tFALL 10 ns 90%
tF
tR
tD1 90% 10%
tR
tD2
90% tF 10%
FIGURE 4-1: Time.
Inverting Driver Switching
FIGURE 4-2: Switching Time.
Non-inverting Driver
DS21998B-page 10
(c) 2007 Microchip Technology Inc.
TC4423A/TC4424A/TC4425A
5.0
5.1
PACKAGING INFORMATION
Package Marking Information (Not to Scale)
8-Lead DFN (6x5) Example:
XXXXXXX XXXXXXX XXYYWW NNN
TC4423A e3 VMF^^ 0520 256
8-Lead PDIP (300 mil) XXXXXXXX XXXXXNNN YYWW
Example: TC4423AV e3 PA^^256 0520
8-Lead SOIC (150 mil)
XXXXXXXX XXXXYYWW NNN
Example: TC4423AV OA^^0520 e3 256
16-Lead SOIC (300 mil)
Example:
XXXXXXXXXXX XXXXXXXXXXX XXXXXXXXXXX YYWWNNN
TC4423A VOE^^ e3 0420256
Legend: XX...X Y YY WW NNN
e3
* Note:
Customer-specific information Year code (last digit of calendar year) Year code (last 2 digits of calendar year) Week code (week of January 1 is week `01') Alphanumeric traceability code Pb-free JEDEC designator for Matte Tin (Sn) This package is Pb-free. The Pb-free JEDEC designator ( e3 ) can be found on the outer packaging for this package.
In the event the full Microchip part number cannot be marked on one line, it will be carried over to the next line, thus limiting the number of available characters for customer-specific information.
(c) 2007 Microchip Technology Inc.
DS21998B-page 11
TC4423A/TC4424A/TC4425A
8-Lead Plastic Dual Flat, No Lead Package (MF) - 6x5 mm Body [DFN-S] PUNCH SINGULATED
Note: For the most current package drawings, please see the Microchip Packaging Specification located at http://www.microchip.com/packaging
D D1 N b
e N K
L
E E1 EXPOSED PAD NOTE 1 1 2 TOP VIEW 2 D2 BOTTOM VIEW 1
E2
NOTE 1
A A1
A2 A3 NOTE 2
Units Dimension Limits Number of Pins Pitch Overall Height Molded Package Thickness Standoff Base Thickness Overall Length Molded Package Length Exposed Pad Length Overall Width Molded Package Width Exposed Pad Width Contact Width Contact Length Contact-to-Exposed Pad Model Draft Angle Top N e A A2 A1 A3 D D1 D2 E E1 E2 b L K 2.16 0.35 0.50 0.20 - 3.85 - - 0.00 MIN
MILLIMETERS NOM 8 1.27 BSC 0.85 0.65 0.01 0.20 REF 4.92 BSC 4.67 BSC 4.00 5.99 BSC 5.74 BSC 2.31 0.40 0.60 - - 2.46 0.47 0.75 - 12 4.15 1.00 0.80 0.05 MAX
Notes: 1. Pin 1 visual index feature may vary, but must be located within the hatched area. 2. Package may have one or more exposed tie bars at ends. 3. Dimensioning and tolerancing per ASME Y14.5M. BSC: Basic Dimension. Theoretically exact value shown without tolerances. REF: Reference Dimension, usually without tolerance, for information purposes only. Microchip Technology Drawing C04-113B
DS21998B-page 12
(c) 2007 Microchip Technology Inc.
TC4423A/TC4424A/TC4425A
8-Lead Plastic Dual In-Line (PA) - 300 mil Body [PDIP]
Note: For the most current package drawings, please see the Microchip Packaging Specification located at http://www.microchip.com/packaging
N
NOTE 1 E1
1
2 D
3 E A2
A
A1 e b1 b
L
c
eB
Units Dimension Limits Number of Pins Pitch Top to Seating Plane Molded Package Thickness Base to Seating Plane Shoulder to Shoulder Width Molded Package Width Overall Length Tip to Seating Plane Lead Thickness Upper Lead Width Lower Lead Width Overall Row Spacing N e A A2 A1 E E1 D L c b1 b eB - .115 .015 .290 .240 .348 .115 .008 .040 .014 - MIN
INCHES NOM 8 .100 BSC - .130 - .310 .250 .365 .130 .010 .060 .018 - .210 .195 - .325 .280 .400 .150 .015 .070 .022 MAX
.430 Notes: 1. Pin 1 visual index feature may vary, but must be located with the hatched area. 2. Significant Characteristic. 3. Dimensions D and E1 do not include mold flash or protrusions. Mold flash or protrusions shall not exceed .010" per side. 4. Dimensioning and tolerancing per ASME Y14.5M. BSC: Basic Dimension. Theoretically exact value shown without tolerances. Microchip Technology Drawing C04-018B
(c) 2007 Microchip Technology Inc.
DS21998B-page 13
TC4423A/TC4424A/TC4425A
8-Lead Plastic Small Outline (OA) - Narrow, 3.90 mm Body [SOIC]
Note: For the most current package drawings, please see the Microchip Packaging Specification located at http://www.microchip.com/packaging
D e N
E E1
NOTE 1 1 2 3 b h c h
A
A2
A1
L L1
Units Dimension Limits Number of Pins Pitch Overall Height Molded Package Thickness Standoff Overall Width Molded Package Width Overall Length Chamfer (optional) Foot Length Footprint Foot Angle Lead Thickness Lead Width Mold Draft Angle Top Mold Draft Angle Bottom N e A A2 A1 E E1 D h L L1 c b 0 0.17 0.31 5 5 0.25 0.40 - 1.25 0.10 MIN
MILLIMETERS NOM 8 1.27 BSC - - - 6.00 BSC 3.90 BSC 4.90 BSC - - 1.04 REF - - - - - 8 0.25 0.51 15 0.50 1.27 1.75 - 0.25 MAX
15 Notes: 1. Pin 1 visual index feature may vary, but must be located within the hatched area. 2. Significant Characteristic. 3. Dimensions D and E1 do not include mold flash or protrusions. Mold flash or protrusions shall not exceed 0.15 mm per side. 4. Dimensioning and tolerancing per ASME Y14.5M. BSC: Basic Dimension. Theoretically exact value shown without tolerances. REF: Reference Dimension, usually without tolerance, for information purposes only. Microchip Technology Drawing C04-057B
DS21998B-page 14
(c) 2007 Microchip Technology Inc.
TC4423A/TC4424A/TC4425A
16-Lead Plastic Small Outline (OE) - Wide, 7.50 mm Body [SOIC]
Note: For the most current package drawings, please see the Microchip Packaging Specification located at http://www.microchip.com/packaging
D N
E E1 NOTE 1 1 23 b h A A2 c
e h
L A1 L1
Units Dimension Limits Number of Pins Pitch Overall Height Molded Package Thickness Standoff Overall Width Molded Package Width Overall Length Chamfer (optional) Foot Length Footprint Foot Angle Lead Thickness Lead Width Mold Draft Angle Top Mold Draft Angle Bottom N e A A2 A1 E E1 D h L L1 c b 0 0.20 0.31 5 5 0.25 0.40 - 2.05 0.10 MIN
MILLIMETERS NOM 16 1.27 BSC - - - 10.30 BSC 7.50 BSC 10.30 BSC - - 1.40 REF - - - - - 8 0.33 0.51 15 0.75 1.27 2.65 - 0.30 MAX
15 Notes: 1. Pin 1 visual index feature may vary, but must be located within the hatched area. 2. Significant Characteristic. 3. Dimensions D and E1 do not include mold flash or protrusions. Mold flash or protrusions shall not exceed 0.15 mm per side. 4. Dimensioning and tolerancing per ASME Y14.5M. BSC: Basic Dimension. Theoretically exact value shown without tolerances. REF: Reference Dimension, usually without tolerance, for information purposes only. Microchip Technology Drawing C04-102B
(c) 2007 Microchip Technology Inc.
DS21998B-page 15
TC4423A/TC4424A/TC4425A
NOTES:
DS21998B-page 16
(c) 2007 Microchip Technology Inc.
TC4423A/TC4424A/TC4425A
APPENDIX A: REVISION HISTORY
Revision B (April 2007)
* Correct numerous errors throughout document. * Page 3: Added Package Power Dissipation information about DC Characteristic Table. * Page 3: Added Note 3 to DC Characteristic Table. * Page 4: Changed Thermal Resistance for 8L-PDIP device from 125 to 84.6. Changed Thermal Resistance for 8L-SOIC from 155 to 163. * Page 12: Updated Package Outline Drawing. * Page 13: Updated Package Outline Drawing. * Page 14: Updated Package Outline Drawing. * Page 15: Added 16-Lead SOIC Package Outline Drawing * Page 17: Updated Revision History.
Revision A (June 2006)
* Original Release of this Document.
(c) 2007 Microchip Technology Inc.
DS21998B-page 17
TC4423A/TC4424A/TC4425A
NOTES:
DS21998B-page 18
(c) 2007 Microchip Technology Inc.
TC4423A/TC4424A/TC4425A
PRODUCT IDENTIFICATION SYSTEM
To order or obtain information, e.g., on pricing or delivery, refer to the factory or the listed sales office. PART NO. Device X Temperature Range XX Package XXX Tape & Reel Examples:
a) TC4423AVOA: 3A Dual Inverting MOSFET Driver, 8LD SOIC package. 3A Dual Inverting MOSFET Driver, 8LD PDIP package. 3A Dual Inverting MOSFET Driver, 8LD DFN package. 3A Dual Inverting MOSFET Driver, 16LD SOIC package.
b)
Device: TC4423A: 3A Dual MOSFET Driver, Inverting TC4424A: 3A Dual MOSFET Driver, Non-Inverting TC4425A: 3A Dual MOSFET Driver, Complementary V = -40C to +125C
TC4423AVPA:
c)
TC4423AVMF:
Temperature Range: Package: *
d)
MF = Dual, Flat, No-Lead (6x5 mm Body), 8-lead MF713 = Dual, Flat, No-Lead (6x5 mm Body), 8-lead (Tape and Reel) OA = Plastic SOIC (150 mil Body), 8-Lead OA713 = Plastic SOIC (150 mil Body), 8-Lead (Tape and Reel) OE = Plastic SOIC (Wide Body), 16-lead OE713 = Plastic SOIC (Wide Body), 16-lead (Tape and Reel) PA = Plastic DIP, (300 mil body), 8-lead * All package offerings are Pb Free (Lead Free)
TC4423AVOE:
a)
TC4424AVOA713: 3A Dual Non-Inverting, MOSFET Driver, 8LD SOIC package, Tape and Reel. TC4424AVPA: 3A Dual Non-Inverting, MOSFET Driver, 8LD PDIP package. 3A Dual Complementary, MOSFET Driver, 8LD SOIC package. 3A Dual Complementary, MOSFET Driver, 8LD PDIP package.
b)
a)
TC4425AVOA:
b)
TC4425AVPA:
c)
TC4425AVOE713: 3A Dual Complementary, MOSFET Driver, 16LD SOIC package, Tape and Reel.
(c) 2007 Microchip Technology Inc.
DS21998B-page 19
TC4423A/TC4424A/TC4425A
NOTES:
DS21998B-page 20
(c) 2007 Microchip Technology Inc.
Note the following details of the code protection feature on Microchip devices: * * * Microchip products meet the specification contained in their particular Microchip Data Sheet. Microchip believes that its family of products is one of the most secure families of its kind on the market today, when used in the intended manner and under normal conditions. There are dishonest and possibly illegal methods used to breach the code protection feature. All of these methods, to our knowledge, require using the Microchip products in a manner outside the operating specifications contained in Microchip's Data Sheets. Most likely, the person doing so is engaged in theft of intellectual property. Microchip is willing to work with the customer who is concerned about the integrity of their code. Neither Microchip nor any other semiconductor manufacturer can guarantee the security of their code. Code protection does not mean that we are guaranteeing the product as "unbreakable."
* *
Code protection is constantly evolving. We at Microchip are committed to continuously improving the code protection features of our products. Attempts to break Microchip's code protection feature may be a violation of the Digital Millennium Copyright Act. If such acts allow unauthorized access to your software or other copyrighted work, you may have a right to sue for relief under that Act.
Information contained in this publication regarding device applications and the like is provided only for your convenience and may be superseded by updates. It is your responsibility to ensure that your application meets with your specifications. MICROCHIP MAKES NO REPRESENTATIONS OR WARRANTIES OF ANY KIND WHETHER EXPRESS OR IMPLIED, WRITTEN OR ORAL, STATUTORY OR OTHERWISE, RELATED TO THE INFORMATION, INCLUDING BUT NOT LIMITED TO ITS CONDITION, QUALITY, PERFORMANCE, MERCHANTABILITY OR FITNESS FOR PURPOSE. Microchip disclaims all liability arising from this information and its use. Use of Microchip devices in life support and/or safety applications is entirely at the buyer's risk, and the buyer agrees to defend, indemnify and hold harmless Microchip from any and all damages, claims, suits, or expenses resulting from such use. No licenses are conveyed, implicitly or otherwise, under any Microchip intellectual property rights.
Trademarks The Microchip name and logo, the Microchip logo, Accuron, dsPIC, KEELOQ, KEELOQ logo, microID, MPLAB, PIC, PICmicro, PICSTART, PRO MATE, PowerSmart, rfPIC, and SmartShunt are registered trademarks of Microchip Technology Incorporated in the U.S.A. and other countries. AmpLab, FilterLab, Linear Active Thermistor, Migratable Memory, MXDEV, MXLAB, PS logo, SEEVAL, SmartSensor and The Embedded Control Solutions Company are registered trademarks of Microchip Technology Incorporated in the U.S.A. Analog-for-the-Digital Age, Application Maestro, CodeGuard, dsPICDEM, dsPICDEM.net, dsPICworks, ECAN, ECONOMONITOR, FanSense, FlexROM, fuzzyLAB, In-Circuit Serial Programming, ICSP, ICEPIC, Mindi, MiWi, MPASM, MPLAB Certified logo, MPLIB, MPLINK, PICkit, PICDEM, PICDEM.net, PICLAB, PICtail, PowerCal, PowerInfo, PowerMate, PowerTool, REAL ICE, rfLAB, rfPICDEM, Select Mode, Smart Serial, SmartTel, Total Endurance, UNI/O, WiperLock and ZENA are trademarks of Microchip Technology Incorporated in the U.S.A. and other countries. SQTP is a service mark of Microchip Technology Incorporated in the U.S.A. All other trademarks mentioned herein are property of their respective companies. (c) 2007, Microchip Technology Incorporated, Printed in the U.S.A., All Rights Reserved. Printed on recycled paper.
Microchip received ISO/TS-16949:2002 certification for its worldwide headquarters, design and wafer fabrication facilities in Chandler and Tempe, Arizona, Gresham, Oregon and Mountain View, California. The Company's quality system processes and procedures are for its PIC(R) MCUs and dsPIC(R) DSCs, KEELOQ(R) code hopping devices, Serial EEPROMs, microperipherals, nonvolatile memory and analog products. In addition, Microchip's quality system for the design and manufacture of development systems is ISO 9001:2000 certified.
(c) 2007 Microchip Technology Inc.
DS21998B-page 21
WORLDWIDE SALES AND SERVICE
AMERICAS
Corporate Office 2355 West Chandler Blvd. Chandler, AZ 85224-6199 Tel: 480-792-7200 Fax: 480-792-7277 Technical Support: http://support.microchip.com Web Address: www.microchip.com Atlanta Duluth, GA Tel: 678-957-9614 Fax: 678-957-1455 Boston Westborough, MA Tel: 774-760-0087 Fax: 774-760-0088 Chicago Itasca, IL Tel: 630-285-0071 Fax: 630-285-0075 Dallas Addison, TX Tel: 972-818-7423 Fax: 972-818-2924 Detroit Farmington Hills, MI Tel: 248-538-2250 Fax: 248-538-2260 Kokomo Kokomo, IN Tel: 765-864-8360 Fax: 765-864-8387 Los Angeles Mission Viejo, CA Tel: 949-462-9523 Fax: 949-462-9608 Santa Clara Santa Clara, CA Tel: 408-961-6444 Fax: 408-961-6445 Toronto Mississauga, Ontario, Canada Tel: 905-673-0699 Fax: 905-673-6509
ASIA/PACIFIC
Asia Pacific Office Suites 3707-14, 37th Floor Tower 6, The Gateway Habour City, Kowloon Hong Kong Tel: 852-2401-1200 Fax: 852-2401-3431 Australia - Sydney Tel: 61-2-9868-6733 Fax: 61-2-9868-6755 China - Beijing Tel: 86-10-8528-2100 Fax: 86-10-8528-2104 China - Chengdu Tel: 86-28-8665-5511 Fax: 86-28-8665-7889 China - Fuzhou Tel: 86-591-8750-3506 Fax: 86-591-8750-3521 China - Hong Kong SAR Tel: 852-2401-1200 Fax: 852-2401-3431 China - Qingdao Tel: 86-532-8502-7355 Fax: 86-532-8502-7205 China - Shanghai Tel: 86-21-5407-5533 Fax: 86-21-5407-5066 China - Shenyang Tel: 86-24-2334-2829 Fax: 86-24-2334-2393 China - Shenzhen Tel: 86-755-8203-2660 Fax: 86-755-8203-1760 China - Shunde Tel: 86-757-2839-5507 Fax: 86-757-2839-5571 China - Wuhan Tel: 86-27-5980-5300 Fax: 86-27-5980-5118 China - Xian Tel: 86-29-8833-7250 Fax: 86-29-8833-7256
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EUROPE
Austria - Wels Tel: 43-7242-2244-39 Fax: 43-7242-2244-393 Denmark - Copenhagen Tel: 45-4450-2828 Fax: 45-4485-2829 France - Paris Tel: 33-1-69-53-63-20 Fax: 33-1-69-30-90-79 Germany - Munich Tel: 49-89-627-144-0 Fax: 49-89-627-144-44 Italy - Milan Tel: 39-0331-742611 Fax: 39-0331-466781 Netherlands - Drunen Tel: 31-416-690399 Fax: 31-416-690340 Spain - Madrid Tel: 34-91-708-08-90 Fax: 34-91-708-08-91 UK - Wokingham Tel: 44-118-921-5869 Fax: 44-118-921-5820
12/08/06
DS21998B-page 22
(c) 2007 Microchip Technology Inc.

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